公司名稱 庫力索法股份有限公司

行業別 半導體設備與材料製造

公司地址 新竹縣竹北市台元一街8號8樓之2

公司網址 http://www.kns.com

營業項目 Wedge Bonder, Ball Bonder, Blades, Capillaries, Advanced Packaging.

職位名稱 Filed Application Engineer, Wire Bond and Dicing

工作內容
Supporting field application test / data collect for APS products solutions (dicing blade/bonding capillary)
•Knowledge: Semiconductor package assembly on wafer saw / package singulation solution. Wafer sawing/Ball bonding application knowledge will be plus
•Strong process DOE (Design of Experiment) & reporting skill
•Problem-solving and analytical skills to interpret product performance and how to meet customers’ criteria as success
•Excellent communication and problem analysis/solving skills
•Responsibility and directs dicing blade field applications/Ball Bond Capillary Tool penetration efforts to maximize product performance and meet business objectives; execute specific plans to ensure the success together with customers.
•Proven experience in process optimization for wide range of wafer sawing / wire bonding applications and packages using application solutions according field application engineering know-how
•Reduce time-to-market by actively pursuing learning of tooling performance and aligning customer interest with application team at real time reporting Plan materials issuance based on production timelines, ensure parts are issued to the production line per production schedule.
•Provides After Product Service business reporting line with competitive and customer information gathering
•Manages technology development and new applications in maintaining a premier technology position for dicing blade/capillary solution offering
•Provided products evaluation reports & knowledge sharing to product team & relevant engineering team

工作地點 新竹縣市，桃園縣市，需出差外派，一年累積時間約三個月以下

科系限制 材料工程相關、電機電子工程相關、機械工程相關

聯絡人 簡 先生

電話：07-5373800 行動：0910723804

電子信箱：hcchien@kns.com

應徵地址 高雄市前鎮區中山二路260號7樓之1